IC (Integrated Circuit) Chips & Components on ICGOODFIND SiteMap
最新文章
- SEMI: Global Semiconductor Equipment Shipments Hit Record $40.5B in Q2 2026 – Up 23% YoY
- AEC‑Q200 Becomes ADAS Gatekeeper – Chinese Inductors Enter High‑Speed Automotive Signal Chains
- Mini-Circuits RF & Microwave Components Guide | Filter, Amplifier, Power Divider, Mixer Selectio
- Oracle Cuts 3,000 Jobs in India – Restructures for AI While Spending $55.7B on Infrastructure
- CXMT Mass-Produces World's First LPDDR6 – Xiaomi 18 Fold Debuts Domestic High-End Memory
- Diodes Q2 Marks Six Consecutive Quarters of Growth – Gross Margin Hits 33.1%
- Intel 18A‑P Process Hits 30% Frequency Boost at 0.5V – Diamond Rapids & Nova Lake First in 2027
- TrendForce: Memory to Take 68% of Cloud CapEx in 2027 – DRAM & HBM Fuel AI Surge
- Avago (Broadcom) Series Overview: Optocouplers, Fiber‑Optic Transceivers & RF Amplifiers
- US Pressures Dutch on DUV Lithography Ban – MATCH Act Targets China Chip Tools
- Yangjie Tech H1 Revenue Hits $633M – Power Semi Surge Across EV, AI, and SiC
- Jingxin Micro Powers Up Two RapidIO Chips – 600Gbps Switch & PCIe Bridge for AI Compute
- Cypress Semiconductor Chip Selection Guide|FRAM, USB Controller & PSoC Programmable SoC Overview
- Samsung Raises Advanced Foundry Prices Up to 15% – AI Demand Tightens 4nm/5nm Supply
- YMTC IPO Passes Key Milestone – Regulatory Review Completed for NAND Giant
- Rockchip H1 Profit Jumps 62% to Record High – Edge AI Drives 40% Revenue Growth
- 2026 IC Supplier Risk Matrix: Lead Time Delay & Price Hike Risk Ranking of Major Chip Vendors
- Tier IV to Open‑Source Its Automotive AI Chip Design – Free NPU Blueprint by 2027
- Kioxia & Sandisk Launch 9th‑Gen 2Tb QLC 3D NAND – 4.8Gb/s Interface, 33% Faster
- Vishay Q2 2026 Revenue Hits $918.6M – Book-to-Bill 1.32 on AI Server Component Boom
- China Bypasses EUV Lithography – Vertical Graphene Transistor Hits 132GHz for 6G Chips
- Taiyo Yuden Q2 MLCC Profit Surges 53.5% – AI Servers Drive Capacity Crunch
- Google AI Legends Leave to Launch Discovery Loop – A New Era in Automated Science
- onsemi Q2 Beats Estimates – AI Server Power Revenue Doubles to $500M in 2026
- TFME Establishes $140M Shenzhen Subsidiary – Expanding Beyond Packaging into Full Semiconductor Chain
- AOS Rolls Out AmpStack Vertical-Stack 80V Half-Bridge MOSFET – Replaces Two DFN5x6 Chips
- Navitas Q2 Revenue Jumps 22% QoQ – AI Data Center Power Drives Strategic Pivot
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Taiyo Yuden to Raise MLCC Prices Again in September – Second Hike This Year
- CXMT Surges Past $50B Market Cap on STAR Market Debut – Overtakes Intel & Tencent
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- TSMC to Raise Foundry Prices Up to 25% in 2027 – HPC Orders Face Premium
- ASML High-NA EUV Components Arrive in Albany – U.S. R&D Gets Next-Gen Lithography Boost
- Kyocera CEO: Semiconductor Parts Boom to Last Until 2030 – Ceramic & MLCC Capacity Ramping
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- TFME H1 Profit Soars Up to 337% – AI & Storage Demand Fuel Packaging Boom
- World’s First 8-Inch 2D Semiconductor Pilot Line Goes Live in Shanghai
- Samsung Tapes Out Tesla AI5 Chip on 2nm at Taylor Fab – Mass Production Set for 2027
- Silex Buys ON Semi’s 200mm U.S. Fab for $40M – MEMS Capacity Play
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- onsemi ESD8004MUTAG: Ultra-Low Capacitance TVS Diode for High-Speed Data Line Protection
- onsemi CPH3362-TL-W: High-Performance N-Channel MOSFET for Power Management Applications
- MMBF0201NLT1G: Key Specifications and Application Circuit Design for the onsemi N-Channel JFET
- Onsemi BAT54CXV3T1G: Schottky Diode Series for High-Efficiency Circuit Design
- onsemi ISL9R18120S3ST: A High-Performance SiC Diode for Advanced Power Conversion
- onsemi SZMMBZ12VALT1G Zener Diode Array: Features, Applications, and Circuit Design Considerations
- Onsemi 2N3055G: A Comprehensive Technical Overview and Application Guide
- onsemi NTK3139PT5G: A Comprehensive Technical Overview of the P-Channel Power MOSFET
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Yongxi Electronics Bets $1.4B on Advanced IC Packaging Megaproject – Will 8-Year Payoff Justify the Gamble?
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Nearfield Instruments Raises $380M Series D – Largest Dutch Deep‑Tech Round Ever
- Nations Technologies Surges 20% on CPO MCU Roadmap for AI Optical Interconnects
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- WinCO Nova 1000mW Single‑Mode 980nm Pump Laser Chip Breaks Global Monopoly
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Nokia Expands Pennsylvania Photonics Plant to Power AI Interconnect, Adds 250 Jobs
- Qualcomm in Talks to Acquire AI Chip Startup Tenstorrent for Up to $10 Billion
- Nvidia Pitches Vera CPU to China Clients: 88‑Core Arm Chip Launching August 2026
- SK Hynix to Triple Wafer Capacity by 2034, Picks Japan for First Overseas Fab
- Moore Threads Open‑Sources MusaCoder: LLM for GPU Kernel Generation, Trained Entirely on Domestic GPUs
- Samsung Plans New Advanced Packaging Plant in Gwangju to Boost HBM and AI Chip Capacity
- JCET Launches 3D Power Module Packaging Solution for AI Data Centers
- Nvidia’s New Vera CPU Picks SK Hynix DRAM as Memory Supplier
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- SK Group Halts SK Siltron Sale at Final Stage, Citing Supercycle and AI Strategy
- Geehy Launches Three G32A Auto MCUs – Mass Production for Body, Lighting, Thermal Management
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- STMicro and Arm Raise Forecasts on AI Infrastructure Boom – ST Sees $1B Data Center Revenue in 2026
- NXP PCA9575HF,118: A Comprehensive Technical Overview of the Low-Voltage 16-Bit I²C-bus I/O Port with Interrupt and Configuration Registers
- Unlocking High-Speed I2C Communication: A Deep Dive into the NXP PCA9617 Differential Bus Buffer
- The NXP PCA9620H: A High-Performance 16-Bit I²C-Bus LED Driver for Advanced Display and Lighting Applications
- NXP PCA9634D,118: A Comprehensive Technical Overview of the 8-Bit Fm+ I2C-Bus LED Controller
- NXP PCA9646PW: A Low-Voltage 2-Channel I²C Bus Switch with Reset Function
- NXP PCA9557PW118: A Comprehensive Technical Overview of the 16-Bit I2C I/O Expander
- NXP PCA9601DP: A Comprehensive Guide to the I²C Bus Differential Active Terminator
- NXP PCA9574PW,118: A Comprehensive Technical Overview of the Low-Voltage 4-Bit I²C GPIO Expander
- Nuvoton NAU8421YG: 24‑Bit Stereo DAC with 128dB SNR, –99dB THD+N
- Marvell Q1 Revenue Hits Record $2.418B, Net Income Falls 81% on Acquisition Costs
- NXP TEF6901AH/V5S: A Comprehensive Technical Overview of a High-Performance Car Radio Single-Chip Receiver
- Unlocking Digital Logic: A Comprehensive Guide to the NXP 74HC259N 8-Bit Addressable Latch
- NXP IP4786CZ32S: A High-Performance USB Type-C Port Protection Controller for Robust System Design
- NXP TEA1721BT/N1: A Highly Integrated Quasi-Resonant Flyback Controller for Cost-Effective Power Supplies
- NXP PCA9506DGG,518: A Comprehensive Technical Overview and Application Guide
- NXP LM75BD118: A Comprehensive Technical Overview of the Digital Temperature Sensor
- NXP BFU520AR: A Comprehensive Technical Overview of the Silicon NPN Wideband Transistor
- NXP MK10DN512ZVLL10: A Comprehensive Technical Overview of the Kinetis K10 Cortex-M4 Microcontroller
- Huawei Kirin Chip Breaks 3GHz with Logic Folding, Unveils Tao Law at ISCAS 2026
- Alibaba Cloud Unveils Zhenwu M890 AI Chip and 128‑Card Supernode Server
- AMD’s Su Meets China VP He Lifeng, Pledges More Investment and Compute Partnership
- ChangXin Memory Q1 Profit Hits 4.6 B , R e v e n u e S u r g e s 719 4.6B,RevenueSurges7197.1B
- NXP P89LPC938FDH: A Comprehensive Technical Overview of the 8-bit Microcontroller
- NXP MC9S08DZ60ACLH: An In-Depth Technical Overview of the 8-bit HCS08 Microcontroller
- NXP Z0103NN 5A, 600V Logic Level TRIAC: Datasheet, Application Circuits, and Replacement Guide
- NXP 74HC4851PW: A Comprehensive Technical Overview of the High-Speed CMOS Analog Multiplexer/Demultiplexer
- HuaHong Q1 Profit Soars 458% to $20.9M, 12-Inch Revenue Hits 62.7%
- NXP BUK9Y38-100E: A High-Performance Automotive MOSFET for Demanding Applications
- NXP LPC824M201JDH20: A Comprehensive Technical Overview of the ARM Cortex-M0+ Microcontroller